yyyyyy x. yyyyyy                                                    0000 xxxxxx xxxx , xxxx , xxxxx 00000

(xxx-xxx-xxxx

abc@xyz.com

 

objective

dynamic product/design engineer eager to contribute expertise toward actively supporting a progressive organization in maximizing development and launch of solutions-focused technology innovations.

 

career profile

ø  over two decades of relevant electronics manufacturing experience.

ø  intel retiree seeking professional assignment re-entry.

ø  career built in wide-ranging facets of computer equipment engineering and development.

ø  expertise in leadership of global and domestic projects of high complexity and critical importance.

ø  knowledgeable in software design, development and implementation related to computer equipment.

ø  involvements spanning graphics card design, hardware thermal analysis, gull wing package devices and microprocessor board design.

ø  outstanding supervisory and mentoring abilities.

ø  skilled in internal customer service environments.

ø  strong evaluative, assessment and diagnostic capacity.

ø  background in effective project management.

ø  contributor in increasing proficiency.

ø  well-organized multi-tasker with strong detail orientation.

ø  adept in aligning electronics manufacturing contributions with organizational objectives.

ø  extensive corporate professional development.

 

professional experience

intel corporation, folsom, ca

product quality engineer                                                                                                           most recent

         promoted to direct product quality/reliability for new agp graphics card design team.

         isolated potential fan bearing lubrication weakness linked to design driven process change.

         initiated lifetest characterizing issue and achieved successful resolution.

         prior to start of lifetest thermal analysis, a fan-less solution was evaluated with prototypes; after thermal mapping, a component identified out-of-spec conditions covering fmea (failure modes and effects analysis).

         successfully utilized ir data/vendor process data to identify affected parameter as non-critical, resulting in  first agp fan-less card launching.

         spearheaded revision of agp card slot, industry standard developed with microsoft, covering card latch and including mechanical tolerance study on atx chassis with pentium ii connector without latches.

 

high volume manufacturing program manager                                                                            1994 - 1997

         advanced to manage program resolving customer assembly failures of large gull-wing package devices.

         effectively assessed data on customer returns and studies performed by malaysian team.

         developed conclusive resolution that also culminated in a well-received customer white paper training lecture, with comment from intel director of q&r that event was unprecedented.

         delivered gull-wing soldering issue presentation at top 26 u.s. assembly sites, starting with at&t and ibm.

         assumed responsibility for training of intel cq on a global basis.

         additionally, trained customer quality engineering in high speed design principles critical to deploying cqe support of system groups products.

         mentored, managed and controlled transfer/expansion of third generation shoo chamber to intel system group.

         acted as q&r stake holder in pentium ii microprocessor package development and validation.

 

 

 

 

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product quality/reliability manager                                                                                             1988 - 1994

         tasked to direct team of six engineers.

         facilitated validation of leading-edge board designs critical to expansion of microprocessor market.

         sourced and completed arrangements with singapore-based assembly contractor, with toshiba certification, prior to launching pcmcia notebooks.

         developed and rolled-out pcmcia type ii card industry through design of interface bus definition, a pcmica bus interface chip and oem pcmcia type ii cards (modems, ethernet, cell phone and gps).

         recipient of u.s. patent on device critical to toshiba launch of notebooks containing pcmcia type ii card slots that corrected toshiba design flaw.

         initiated technical model for application of shoo chamber at pc system level related to signal propagation.

         above prompted ibm boca raton acquisition offer after a joint qualification program of ibm workstation processor/card.

         ensured shoo chamber testing and design resolutions producing higher factory yields and customer satisfaction.

         chamber isolated points within normal operation window allowing seemingly random failure to be debugged, eliminating ndf returns.

         conducted monitoring and control of shock, drop, esd and emi testing of all pc, pcmcia and ibm workstation cards.

         orchestrated and administered quality program that rolled-out intel boxed processors and aided formation of rpd.

 

earlier background

prior to 1988, served intel as program manager, wildcard 88™, product quality engineer, supplier/manufacturing quality engineer and supplier quality engineer.  in these assignments built outstanding project management, design, testing, fabrication, cost control, bench testing and technical flaw resolution skill sets.

 

education

los rios college, folsom, ca

project quality management, 2009

 

intel university, santa clara, ca

manager training program, 1997

 

 

professional development

extensive training in productivity, quality, six sigma, lean manufacturing, statistical process control and aerospace instrumentation.